Area selective atomic layer deposition (AS-ALD) for electronic device applications

Due to the continuous shrinking of microelectronic devices, nanoscale materials are being deposited and stacked into the high density multilayer structures (e.g. 3D-FETs, interconnects, core shell structures, etc). However, advanced and novel process methods are required for the fabrication of these...

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Bibliographic Details
Main Author: Mayank Rajput
Other Authors: Nripan Mathews
Format: Theses and Dissertations
Language:English
Published: 2018
Subjects:
Online Access:http://hdl.handle.net/10356/73109
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Institution: Nanyang Technological University
Language: English