Nondestructive void size determination in copper metallization under passivation

A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to el...

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Main Authors: Gan, Zhenghao, Tan, Cher Ming, Zhang, Guan
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
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Online Access:https://hdl.handle.net/10356/79913
http://hdl.handle.net/10220/4709
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-799132020-03-07T13:57:21Z Nondestructive void size determination in copper metallization under passivation Gan, Zhenghao Tan, Cher Ming Zhang, Guan School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to electron beam shining and biased by a small external voltage. Finite-element analysis is performed to simulate the temperature distribution and current alteration in the metal line. The electron-beam heating is demonstrated as the most important factor contributing to the current alteration. Reconstruction of voids with any shape(such as wedge or slit) is possible on the basis of the gradient of the current alteration. It is found that the minimum detectable void size can be as low as 50 nm. Experimental verification of the technique is underway. Published version 2009-07-28T03:51:25Z 2019-12-06T13:36:39Z 2009-07-28T03:51:25Z 2019-12-06T13:36:39Z 2003 2003 Journal Article Gan, Z., Tan, C. M., & Zhang, G. (2003). Nondestructive void size determination in copper metallization under passivation. IEEE Transactions on Device and Materials Reliability, (3)3, 69-78. 1530-4388 https://hdl.handle.net/10356/79913 http://hdl.handle.net/10220/4709 10.1109/TDMR.2003.815285 en IEEE transactions on device and materials reliability © 2003 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 10 p. application/pdf
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Gan, Zhenghao
Tan, Cher Ming
Zhang, Guan
Nondestructive void size determination in copper metallization under passivation
description A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to electron beam shining and biased by a small external voltage. Finite-element analysis is performed to simulate the temperature distribution and current alteration in the metal line. The electron-beam heating is demonstrated as the most important factor contributing to the current alteration. Reconstruction of voids with any shape(such as wedge or slit) is possible on the basis of the gradient of the current alteration. It is found that the minimum detectable void size can be as low as 50 nm. Experimental verification of the technique is underway.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Gan, Zhenghao
Tan, Cher Ming
Zhang, Guan
format Article
author Gan, Zhenghao
Tan, Cher Ming
Zhang, Guan
author_sort Gan, Zhenghao
title Nondestructive void size determination in copper metallization under passivation
title_short Nondestructive void size determination in copper metallization under passivation
title_full Nondestructive void size determination in copper metallization under passivation
title_fullStr Nondestructive void size determination in copper metallization under passivation
title_full_unstemmed Nondestructive void size determination in copper metallization under passivation
title_sort nondestructive void size determination in copper metallization under passivation
publishDate 2009
url https://hdl.handle.net/10356/79913
http://hdl.handle.net/10220/4709
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