Nondestructive void size determination in copper metallization under passivation

• Main Authors: Gan, Zhenghao, Tan, Cher Ming, Zhang, Guan
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/79913; http://hdl.handle.net/10220/4709
• Institution: Nanyang Technological University

A novel nondestructive failure analysis technique to rapidly locate tiny voids in narrow metallization line covered with passivation is proposed, based on the simulation results. In this technique, the current alteration in a metal line under study is recorded continuously when it is subjected to el...