Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing

• المؤلفون الرئيسيون: Nguyen, N. Y., Tian, Yebing, Zhong, Zhao Wei
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Chemical mechanical polishing; Computational fluid dynamic
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/85031; http://hdl.handle.net/10220/40943
• المؤسسة: Nanyang Technological University

Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was...