Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates

• المؤلفون الرئيسيون: Tian, Yebing, Zhong, Zhaowei, Ng, Jun Hao
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Chemical-mechanical polishing; Fixed abrasive pad
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/85042; http://hdl.handle.net/10220/40950
• المؤسسة: Nanyang Technological University

Chemical mechanical polishing (CMP) with fixed abrasive pad is an alternative machining method to loose abrasive lapping and partial polishing with traditional pad in the fabrication of optical silicon substrates. However, the effects of chemical slurry on the fixed abrasive polishing performance ar...