Novel high temperature polymeric encapsulation material for extreme environment electronics packaging

• Main Authors: Phua, Eric Jian Rong, Liu, Ming, Cho, Bokun, Liu, Qing, Amini, Shahrouz, Hu, Xiao, Gan, Chee Lip
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2019
• Subjects: High Pressure; High Temperature; Engineering::Materials
• Online Access: https://hdl.handle.net/10356/90058; http://hdl.handle.net/10220/49430
• Institution: Nanyang Technological University

This study explores the usage of resorcinol based phthalonitrile (rPN) in harsh environment electronics encapsulation applications. rPN itself exhibits excellent properties as a high temperature polymeric molding compound in terms of mechanical properties and thermal stability. Its properties improv...