Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth

• Main Authors: Nai, S. M. L., Xu, L. Y., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Conference or Workshop Item
• 語言: English
• 出版: 2010
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• 在線閱讀: https://hdl.handle.net/10356/91728; http://hdl.handle.net/10220/6293

In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the assoldered con...