Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth
In the present study, Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into the Sn-Ag-Cu matrix, to form a composite solder. The interfacial intermetallic compound layer thickness formed on electroless nickel immersion gold (ENIG) metallized Cu substrate was determined under the assoldered con...
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Main Authors: | Nai, S. M. L., Xu, L. Y., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2010
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/91728 http://hdl.handle.net/10220/6293 |
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Institution: | Nanyang Technological University |
Language: | English |
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