The strength of the silicon die in flip-chip assemblies

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it...

Full description

Saved in:
Bibliographic Details
Main Authors: Chen, Z., Han, J. B., Tan, N. X., Cotterell, Brian
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/94829
http://hdl.handle.net/10220/7710
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
id sg-ntu-dr.10356-94829
record_format dspace
spelling sg-ntu-dr.10356-948292020-06-01T10:26:31Z The strength of the silicon die in flip-chip assemblies Chen, Z. Han, J. B. Tan, N. X. Cotterell, Brian School of Materials Science & Engineering DRNTU::Engineering::Materials The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the "strength" of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined. 2012-04-11T01:06:11Z 2019-12-06T19:03:02Z 2012-04-11T01:06:11Z 2019-12-06T19:03:02Z 2003 2003 Journal Article Cotterell, B., Chen, Z., Han, J. B., & Tan, N. X. (2003). The Strength of the Silicon Die in Flip Chip Assemblies. Journal of Electronic Packaging, 125(1), 114-119. https://hdl.handle.net/10356/94829 http://hdl.handle.net/10220/7710 10.1115/1.1535934 en Journal of electronic packaging © 2003 by ASME
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Chen, Z.
Han, J. B.
Tan, N. X.
Cotterell, Brian
The strength of the silicon die in flip-chip assemblies
description The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the "strength" of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Chen, Z.
Han, J. B.
Tan, N. X.
Cotterell, Brian
format Article
author Chen, Z.
Han, J. B.
Tan, N. X.
Cotterell, Brian
author_sort Chen, Z.
title The strength of the silicon die in flip-chip assemblies
title_short The strength of the silicon die in flip-chip assemblies
title_full The strength of the silicon die in flip-chip assemblies
title_fullStr The strength of the silicon die in flip-chip assemblies
title_full_unstemmed The strength of the silicon die in flip-chip assemblies
title_sort strength of the silicon die in flip-chip assemblies
publishDate 2012
url https://hdl.handle.net/10356/94829
http://hdl.handle.net/10220/7710
_version_ 1681058627806298112