The strength of the silicon die in flip-chip assemblies

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it...

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Bibliographic Details
Main Authors: Chen, Z., Han, J. B., Tan, N. X., Cotterell, Brian
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/94829
http://hdl.handle.net/10220/7710
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Institution: Nanyang Technological University
Language: English

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