The strength of the silicon die in flip-chip assemblies

• المؤلفون الرئيسيون: Chen, Z., Han, J. B., Tan, N. X., Cotterell, Brian
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94829; http://hdl.handle.net/10220/7710

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it...