Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

• Main Authors: Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/97751; http://hdl.handle.net/10220/11237
• Institution: Nanyang Technological University

The electromigration behaviour of Cu/SiCOH interconnects carrying unipolar pulsed current with long periods (i.e. 2, 16, 32 and 48 h) is presented in this study. Experimental observations suggest that the electromigration behaviour during void growth can be described by the ON-time model and that th...