Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

The electromigration behaviour of Cu/SiCOH interconnects carrying unipolar pulsed current with long periods (i.e. 2, 16, 32 and 48 h) is presented in this study. Experimental observations suggest that the electromigration behaviour during void growth can be described by the ON-time model and that th...

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書目詳細資料
Main Authors:	Lim, Meng Keong, Lin, Jingyuan, Ee, Elden Yong Chiang, Ng, Chee Mang, Wei, Jun, Gan, Chee Lip
其他作者:	School of Materials Science & Engineering
格式:	Article
語言:	English
出版:	2013
主題:	DRNTU::Engineering::Materials
在線閱讀:	https://hdl.handle.net/10356/97751 http://hdl.handle.net/10220/11237
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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