The influence of titanium nitride barrier layer on the properties of CNT bundles
The use of carbon nanotubes (CNTs) for electrical interconnections is hinder by the possibility of growing CNT directly onto metallization. The introduction of barrier layer between catalyst and metallization is thus essential to permit the direct growth of vertically aligned CNT bundles using CVD a...
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Main Authors: | Yap, Chin Chong, Tan, Dunlin, Brun, Christophe, Li, Hong, Teo, Edwin Hang Tong, Dominique, Baillargeat, Tay, Beng Kang |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Conference or Workshop Item |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/99396 http://hdl.handle.net/10220/17371 |
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Institution: | Nanyang Technological University |
Language: | English |
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