Orientation anomalies in plating thickness measurements from advanced packaging substrates

10.1088/0268-1242/11/3/026

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Bibliographic Details
Main Authors:	Tan, N.X., Lee, A.J.Y., Bourdillon, A.J., Tan, C.Y.S.
Other Authors:	MATERIALS SCIENCE
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/107154
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-107154
record_format	dspace
spelling	sg-nus-scholar.10635-1071542023-10-30T20:13:33Z Orientation anomalies in plating thickness measurements from advanced packaging substrates Tan, N.X. Lee, A.J.Y. Bourdillon, A.J. Tan, C.Y.S. MATERIALS SCIENCE 10.1088/0268-1242/11/3/026 Semiconductor Science and Technology 11 3 437-442 SSTEE 2014-10-29T08:40:16Z 2014-10-29T08:40:16Z 1996-03 Article Tan, N.X., Lee, A.J.Y., Bourdillon, A.J., Tan, C.Y.S. (1996-03). Orientation anomalies in plating thickness measurements from advanced packaging substrates. Semiconductor Science and Technology 11 (3) : 437-442. ScholarBank@NUS Repository. https://doi.org/10.1088/0268-1242/11/3/026 02681242 http://scholarbank.nus.edu.sg/handle/10635/107154 A1996TZ79700024 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1088/0268-1242/11/3/026
author2	MATERIALS SCIENCE
author_facet	MATERIALS SCIENCE Tan, N.X. Lee, A.J.Y. Bourdillon, A.J. Tan, C.Y.S.
format	Article
author	Tan, N.X. Lee, A.J.Y. Bourdillon, A.J. Tan, C.Y.S.
spellingShingle	Tan, N.X. Lee, A.J.Y. Bourdillon, A.J. Tan, C.Y.S. Orientation anomalies in plating thickness measurements from advanced packaging substrates
author_sort	Tan, N.X.
title	Orientation anomalies in plating thickness measurements from advanced packaging substrates
title_short	Orientation anomalies in plating thickness measurements from advanced packaging substrates
title_full	Orientation anomalies in plating thickness measurements from advanced packaging substrates
title_fullStr	Orientation anomalies in plating thickness measurements from advanced packaging substrates
title_full_unstemmed	Orientation anomalies in plating thickness measurements from advanced packaging substrates
title_sort	orientation anomalies in plating thickness measurements from advanced packaging substrates
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/107154
_version_	1781788346297614336

Orientation anomalies in plating thickness measurements from advanced packaging substrates

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