Orientation anomalies in plating thickness measurements from advanced packaging substrates
10.1088/0268-1242/11/3/026
Saved in:
Main Authors: | Tan, N.X., Lee, A.J.Y., Bourdillon, A.J., Tan, C.Y.S. |
---|---|
Other Authors: | MATERIALS SCIENCE |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/107154 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Analysis of coatings which inhibit epoxy bleeding in electronic packaging
by: Tan, N.X., et al.
Published: (2014) -
Displacement damage in supported YBa2Cu3O7-x thin films and finite-element simulations
by: Bourdillon, A.J., et al.
Published: (2014) -
Advanced electronic packaging substrate (ball grid array)
by: Li, Jianjun.
Published: (2008) -
Hot isostatically pressed Bi2Sr2Ca2Cu3O10 coils made with novel precursors
by: Bourdillon, A.J., et al.
Published: (2014) -
A COMPUTER SOFTWARE PACKAGE FOR THICK TARGET PIXE ANALYSIS
by: TAN KAY HING
Published: (2020)