Orientation anomalies in plating thickness measurements from advanced packaging substrates

10.1088/0268-1242/11/3/026

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Bibliographic Details
Main Authors: Tan, N.X., Lee, A.J.Y., Bourdillon, A.J., Tan, C.Y.S.
Other Authors: MATERIALS SCIENCE
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/107154
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Institution: National University of Singapore

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