A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

10.1088/0960-1317/16/9/012

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Bibliographic Details
Main Authors: Rao, V.S., Kripesh, V., Yoon, S.W., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59312
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/59312

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