A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

10.1088/0960-1317/16/9/012

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Bibliographic Details
Main Authors:	Rao, V.S., Kripesh, V., Yoon, S.W., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59312
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-59312
record_format	dspace
spelling	sg-nus-scholar.10635-593122023-10-30T08:09:39Z A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist Rao, V.S. Kripesh, V. Yoon, S.W. Tay, A.A.O. MECHANICAL ENGINEERING 10.1088/0960-1317/16/9/012 Journal of Micromechanics and Microengineering 16 9 1841-1846 JMMIE 2014-06-17T06:09:58Z 2014-06-17T06:09:58Z 2006-09-01 Article Rao, V.S., Kripesh, V., Yoon, S.W., Tay, A.A.O. (2006-09-01). A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist. Journal of Micromechanics and Microengineering 16 (9) : 1841-1846. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/16/9/012 09601317 http://scholarbank.nus.edu.sg/handle/10635/59312 000239774600031 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1088/0960-1317/16/9/012
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Rao, V.S. Kripesh, V. Yoon, S.W. Tay, A.A.O.
format	Article
author	Rao, V.S. Kripesh, V. Yoon, S.W. Tay, A.A.O.
spellingShingle	Rao, V.S. Kripesh, V. Yoon, S.W. Tay, A.A.O. A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
author_sort	Rao, V.S.
title	A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
title_short	A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
title_full	A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
title_fullStr	A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
title_full_unstemmed	A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
title_sort	thick photoresist process for advanced wafer level packaging applications using jsr thb-151n negative tone uv photoresist
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/59312
_version_	1781781604174135296

A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist

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