A thick photoresist process for advanced wafer level packaging applications using JSR THB-151N negative tone UV photoresist
10.1088/0960-1317/16/9/012
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/59312 |
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| Institution: | National University of Singapore |