Finite element analysis for microwave cure of underfill in flip chip packaging

Finite element analysis for microwave cure of underfill in flip chip packaging

10.1016/j.tsf.2004.05.060

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Bibliographic Details
Main Authors: Liu, L., Yi, S., Ong, L.S., Chian, K.S.
Other Authors: TEMASEK LABORATORIES
Format: Article
Published: 2014
Subjects:
Computer simulation
Microwave
Reaction kinetics
Online Access:http://scholarbank.nus.edu.sg/handle/10635/111402
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Institution: National University of Singapore
id sg-nus-scholar.10635-111402
record_format dspace
spelling sg-nus-scholar.10635-1114022024-11-14T08:54:10Z Finite element analysis for microwave cure of underfill in flip chip packaging Liu, L. Yi, S. Ong, L.S. Chian, K.S. TEMASEK LABORATORIES Computer simulation Microwave Reaction kinetics 10.1016/j.tsf.2004.05.060 Thin Solid Films 462-463 SPEC. ISS. 436-445 THSFA 2014-11-28T01:51:48Z 2014-11-28T01:51:48Z 2004-09 Article Liu, L., Yi, S., Ong, L.S., Chian, K.S. (2004-09). Finite element analysis for microwave cure of underfill in flip chip packaging. Thin Solid Films 462-463 (SPEC. ISS.) : 436-445. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.060 00406090 http://scholarbank.nus.edu.sg/handle/10635/111402 000223812800085 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Computer simulation
Microwave
Reaction kinetics
spellingShingle Computer simulation
Microwave
Reaction kinetics
Liu, L.
Yi, S.
Ong, L.S.
Chian, K.S.
Finite element analysis for microwave cure of underfill in flip chip packaging
description 10.1016/j.tsf.2004.05.060
author2 TEMASEK LABORATORIES
author_facet TEMASEK LABORATORIES
Liu, L.
Yi, S.
Ong, L.S.
Chian, K.S.
format Article
author Liu, L.
Yi, S.
Ong, L.S.
Chian, K.S.
author_sort Liu, L.
title Finite element analysis for microwave cure of underfill in flip chip packaging
title_short Finite element analysis for microwave cure of underfill in flip chip packaging
title_full Finite element analysis for microwave cure of underfill in flip chip packaging
title_fullStr Finite element analysis for microwave cure of underfill in flip chip packaging
title_full_unstemmed Finite element analysis for microwave cure of underfill in flip chip packaging
title_sort finite element analysis for microwave cure of underfill in flip chip packaging
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/111402
_version_ 1821221173603598336

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