Finite element analysis for microwave cure of underfill in flip chip packaging

Finite element analysis for microwave cure of underfill in flip chip packaging

10.1016/j.tsf.2004.05.060

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書目詳細資料
Main Authors:	Liu, L., Yi, S., Ong, L.S., Chian, K.S.
其他作者:	TEMASEK LABORATORIES
格式:	Article
出版:	2014
主題:	Computer simulation Microwave Reaction kinetics
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/111402
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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