Pulsed electrodeposition of high aspect-ratio NiFe assemblies and its influence on spatial alloy composition
10.1007/s00542-008-0614-3
Saved in:
Main Authors: | Giro, F., Bedner, K., Dhum, C., Hoffmann, J.E., Heussler, S.P., Jian, L., Kirsch, U., Moser, H.O., Saumer, M. |
---|---|
Other Authors: | SINGAPORE SYNCHROTRON LIGHT SOURCE |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/113037 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Reliable fabrication of high aspect ratio plasmonic nanostructures based on seedless pulsed electrodeposition
by: Mueller, Aaron David, et al.
Published: (2020) -
Magnetic properties of pulse-reverse electrodeposited nanocrystalline NiFe/Cu composite wires in relation to the anodic current
by: Seet, H.L., et al.
Published: (2014) -
Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
by: Li, X.P., et al.
Published: (2014) -
Combining sonicated cold development and pulsed electrodeposition for high aspect ratio sub-10 nm gap gold dimers for sensing applications in the visible spectrum
by: Zhang, Dao Hua, et al.
Published: (2019) -
SIMULATION OF COPPER ELECTRODEPOSITION FOR HIGH ASPECT RATIO THROUGH- SILICON VIA APPLICATIONS IN THREE- DIMENSIONAL INTEGRATED CIRCUITS
by: NAGARAJAN RAGHAVAN
Published: (2019)