Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

10.1023/A:1015230727381

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Bibliographic Details
Main Authors:	Maung Latt, K., Park, H.S., Li, S., Rong, L., Osipowicz, T., Zhu, W.G., Lee, Y.K.
Other Authors:	INSTITUTE OF ENGINEERING SCIENCE
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/113071
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-1130712024-11-09T07:25:00Z Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2 Maung Latt, K. Park, H.S. Li, S. Rong, L. Osipowicz, T. Zhu, W.G. Lee, Y.K. INSTITUTE OF ENGINEERING SCIENCE PHYSICS 10.1023/A:1015230727381 Journal of Materials Science 37 10 1941-1949 JMTSA 2014-11-28T09:11:38Z 2014-11-28T09:11:38Z 2002-05-15 Article Maung Latt, K.,Park, H.S.,Li, S.,Rong, L.,Osipowicz, T.,Zhu, W.G.,Lee, Y.K. (2002-05-15). Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2. Journal of Materials Science 37 (10) : 1941-1949. ScholarBank@NUS Repository. <a href="https://doi.org/10.1023/A:1015230727381" target="_blank">https://doi.org/10.1023/A:1015230727381</a> 00222461 http://scholarbank.nus.edu.sg/handle/10635/113071 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1023/A:1015230727381
author2	INSTITUTE OF ENGINEERING SCIENCE
author_facet	INSTITUTE OF ENGINEERING SCIENCE Maung Latt, K. Park, H.S. Li, S. Rong, L. Osipowicz, T. Zhu, W.G. Lee, Y.K.
format	Article
author	Maung Latt, K. Park, H.S. Li, S. Rong, L. Osipowicz, T. Zhu, W.G. Lee, Y.K.
spellingShingle	Maung Latt, K. Park, H.S. Li, S. Rong, L. Osipowicz, T. Zhu, W.G. Lee, Y.K. Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
author_sort	Maung Latt, K.
title	Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
title_short	Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
title_full	Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
title_fullStr	Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
title_full_unstemmed	Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
title_sort	behaviour of ionized metal plasma deposited ta diffusion barrier between cu and sio2
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/113071
_version_	1821181911441080320

Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2

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