Behaviour of ionized metal plasma deposited Ta diffusion barrier between Cu and SiO2
10.1023/A:1015230727381
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Main Authors: | Maung Latt, K., Park, H.S., Li, S., Rong, L., Osipowicz, T., Zhu, W.G., Lee, Y.K. |
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Other Authors: | PHYSICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/113071 |
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Institution: | National University of Singapore |
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