Study of copper diffusion into Ta and TaN barrier materials for MOS devices

10.1016/j.tsf.2004.05.102

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Main Authors: Loh, S.W., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S.
Other Authors: INSTITUTE OF ENGINEERING SCIENCE
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/115302
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-1153022024-11-12T21:16:36Z Study of copper diffusion into Ta and TaN barrier materials for MOS devices Loh, S.W. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. INSTITUTE OF ENGINEERING SCIENCE PHYSICS Barrier Copper Diffusion Diffusion coefficient 10.1016/j.tsf.2004.05.102 Thin Solid Films 462-463 SPEC. ISS. 240-244 THSFA 2014-12-12T07:13:47Z 2014-12-12T07:13:47Z 2004-09 Article Loh, S.W., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S. (2004-09). Study of copper diffusion into Ta and TaN barrier materials for MOS devices. Thin Solid Films 462-463 (SPEC. ISS.) : 240-244. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.102 00406090 http://scholarbank.nus.edu.sg/handle/10635/115302 000223812800050 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Barrier
Copper
Diffusion
Diffusion coefficient
spellingShingle Barrier
Copper
Diffusion
Diffusion coefficient
Loh, S.W.
Zhang, D.H.
Li, C.Y.
Liu, R.
Wee, A.T.S.
Study of copper diffusion into Ta and TaN barrier materials for MOS devices
description 10.1016/j.tsf.2004.05.102
author2 INSTITUTE OF ENGINEERING SCIENCE
author_facet INSTITUTE OF ENGINEERING SCIENCE
Loh, S.W.
Zhang, D.H.
Li, C.Y.
Liu, R.
Wee, A.T.S.
format Article
author Loh, S.W.
Zhang, D.H.
Li, C.Y.
Liu, R.
Wee, A.T.S.
author_sort Loh, S.W.
title Study of copper diffusion into Ta and TaN barrier materials for MOS devices
title_short Study of copper diffusion into Ta and TaN barrier materials for MOS devices
title_full Study of copper diffusion into Ta and TaN barrier materials for MOS devices
title_fullStr Study of copper diffusion into Ta and TaN barrier materials for MOS devices
title_full_unstemmed Study of copper diffusion into Ta and TaN barrier materials for MOS devices
title_sort study of copper diffusion into ta and tan barrier materials for mos devices
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/115302
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