Study of copper diffusion into Ta and TaN barrier materials for MOS devices
10.1016/j.tsf.2004.05.102
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sg-nus-scholar.10635-1153022024-11-12T21:16:36Z Study of copper diffusion into Ta and TaN barrier materials for MOS devices Loh, S.W. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. INSTITUTE OF ENGINEERING SCIENCE PHYSICS Barrier Copper Diffusion Diffusion coefficient 10.1016/j.tsf.2004.05.102 Thin Solid Films 462-463 SPEC. ISS. 240-244 THSFA 2014-12-12T07:13:47Z 2014-12-12T07:13:47Z 2004-09 Article Loh, S.W., Zhang, D.H., Li, C.Y., Liu, R., Wee, A.T.S. (2004-09). Study of copper diffusion into Ta and TaN barrier materials for MOS devices. Thin Solid Films 462-463 (SPEC. ISS.) : 240-244. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.102 00406090 http://scholarbank.nus.edu.sg/handle/10635/115302 000223812800050 Scopus |
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Barrier Copper Diffusion Diffusion coefficient |
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Barrier Copper Diffusion Diffusion coefficient Loh, S.W. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
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10.1016/j.tsf.2004.05.102 |
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INSTITUTE OF ENGINEERING SCIENCE |
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INSTITUTE OF ENGINEERING SCIENCE Loh, S.W. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. |
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Article |
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Loh, S.W. Zhang, D.H. Li, C.Y. Liu, R. Wee, A.T.S. |
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Loh, S.W. |
title |
Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
title_short |
Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
title_full |
Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
title_fullStr |
Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
title_full_unstemmed |
Study of copper diffusion into Ta and TaN barrier materials for MOS devices |
title_sort |
study of copper diffusion into ta and tan barrier materials for mos devices |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/115302 |
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