A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

Ph.D

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Bibliographic Details
Main Author:	ZHAO BING
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/13262
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-13262
record_format	dspace
spelling	sg-nus-scholar.10635-132622015-01-08T08:30:42Z A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages ZHAO BING MECHANICAL ENGINEERING TAY AH ONG, ANDREW PRAKASH THAMBURAJA solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T10:31:26Z 2010-04-08T10:31:26Z 2008-05-20 Thesis ZHAO BING (2008-05-20). A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13262 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE
spellingShingle	solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE ZHAO BING A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING ZHAO BING
format	Theses and Dissertations
author	ZHAO BING
author_sort	ZHAO BING
title	A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
title_short	A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
title_full	A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
title_fullStr	A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
title_full_unstemmed	A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages
title_sort	study of stretched solder column interconnects for ultra-fine pitch flip clip packages
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/13262
_version_	1681078827616305152

A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

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