A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

Ph.D

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Bibliographic Details
Main Author: ZHAO BING
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE
Online Access:http://scholarbank.nus.edu.sg/handle/10635/13262
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Institution: National University of Singapore
Language: English

Internet

http://scholarbank.nus.edu.sg/handle/10635/13262

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