A study of Stretched Solder Column Interconnects for Ultra-Fine Pitch Flip Clip Packages

Ph.D

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Bibliographic Details
Main Author:	ZHAO BING
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	solder column, slim sector model, thermal fatigue, solder joint reliability, solder joint geometry prediction, RVE
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/13262
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Institution:	National University of Singapore
Language:	English

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