RELIABILITY OF SOLDER JOINTS IN IC PACKAGES

Master's

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Bibliographic Details
Main Author:	LIM BENG KUAN
Other Authors:	SINGAPORE-MIT ALLIANCE
Format:	Theses and Dissertations
Published:	2019
Subjects:	Solder joint reliability Finite Element Analysis fatigue life prediction accelerated thermal cycling creep plasticity energy density microstructure evolution Coefficient of thermal Expansion Constitutive relation
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/154033
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-154033
record_format	dspace
spelling	sg-nus-scholar.10635-1540332019-05-29T07:18:40Z RELIABILITY OF SOLDER JOINTS IN IC PACKAGES LIM BENG KUAN SINGAPORE-MIT ALLIANCE LI YI ZHOU WEI Solder joint reliability Finite Element Analysis fatigue life prediction accelerated thermal cycling creep plasticity energy density microstructure evolution Coefficient of thermal Expansion Constitutive relation Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-10T07:27:50Z 2019-05-10T07:27:50Z 2003 Thesis LIM BENG KUAN (2003). RELIABILITY OF SOLDER JOINTS IN IC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154033 SMA BATCHLOAD 20190422
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Solder joint reliability Finite Element Analysis fatigue life prediction accelerated thermal cycling creep plasticity energy density microstructure evolution Coefficient of thermal Expansion Constitutive relation
spellingShingle	Solder joint reliability Finite Element Analysis fatigue life prediction accelerated thermal cycling creep plasticity energy density microstructure evolution Coefficient of thermal Expansion Constitutive relation LIM BENG KUAN RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
description	Master's
author2	SINGAPORE-MIT ALLIANCE
author_facet	SINGAPORE-MIT ALLIANCE LIM BENG KUAN
format	Theses and Dissertations
author	LIM BENG KUAN
author_sort	LIM BENG KUAN
title	RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
title_short	RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
title_full	RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
title_fullStr	RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
title_full_unstemmed	RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
title_sort	reliability of solder joints in ic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/154033
_version_	1681099328605650944

RELIABILITY OF SOLDER JOINTS IN IC PACKAGES

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