DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES

Master's

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Bibliographic Details
Main Author:	EDI ANTO
Other Authors:	SINGAPORE-MIT ALLIANCE
Format:	Theses and Dissertations
Published:	2019
Subjects:	BGA solder joints board-level drop test Finite Element Analysis impact reliability acceleration SMD \|NSMD
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/154135
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-154135
record_format	dspace
spelling	sg-nus-scholar.10635-1541352024-10-26T00:11:55Z DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES EDI ANTO SINGAPORE-MIT ALLIANCE ZHOU WEI WONG CHEE CHEONG BGA solder joints board-level drop test Finite Element Analysis impact reliability acceleration SMD \|NSMD Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS Dissertation Advisors : Assoc. Prof. Wong Chee Cheong, SMA Fellow, NUS, Project Supervisor : Dr. Zhou Wei, MICRON Semiconductor Asia 2019-05-15T04:18:35Z 2019-05-15T04:18:35Z 2004 Thesis EDI ANTO (2004). DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154135 SMA BATCHLOAD 20190422
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	BGA solder joints board-level drop test Finite Element Analysis impact reliability acceleration SMD \|NSMD
spellingShingle	BGA solder joints board-level drop test Finite Element Analysis impact reliability acceleration SMD \|NSMD EDI ANTO DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
description	Master's
author2	SINGAPORE-MIT ALLIANCE
author_facet	SINGAPORE-MIT ALLIANCE EDI ANTO
format	Theses and Dissertations
author	EDI ANTO
author_sort	EDI ANTO
title	DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
title_short	DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
title_full	DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
title_fullStr	DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
title_full_unstemmed	DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
title_sort	development of drop-test simulation and reliability characterization for ic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/154135
_version_	1821200017197629440

DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES

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