DEVELOPMENT OF DROP-TEST SIMULATION AND RELIABILITY CHARACTERIZATION FOR IC PACKAGES
Master's
Saved in:
Main Author: | EDI ANTO |
---|---|
Other Authors: | SINGAPORE-MIT ALLIANCE |
Format: | Theses and Dissertations |
Published: |
2019
|
Subjects: | |
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/154135 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact
by: Luan, J.-E., et al.
Published: (2014) -
Board level drop testing of advanced IC packaging
by: PEK WEE SONG, ERIC
Published: (2010) -
Finite element modeling of electronic packages subjected to drop impact
by: Tan, V.B.C., et al.
Published: (2014) -
Static and dynamic flexure of PCBs in electronic packaging assemblies
by: ONG YEOW CHON
Published: (2010) -
RELIABILITY OF SOLDER JOINTS IN IC PACKAGES
by: LIM BENG KUAN
Published: (2019)