THE ENCHANCED COOLING OF IC CHIP ARRAYS ON PRINTED CIRCUIT BOARDS (PCBS)
Master's
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Main Author: | LOW KEK WEE |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Published: |
2019
|
Online Access: | https://scholarbank.nus.edu.sg/handle/10635/158752 |
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Institution: | National University of Singapore |
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