Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

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Bibliographic Details
Main Author:	ONG MENG GUAN, JIMMY
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Solder Joint Reliability, Finite Element Analysis, 65nm Cu/low-k, Large die, Flip Chip Package
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15936
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-15936
record_format	dspace
spelling	sg-nus-scholar.10635-159362015-01-26T14:01:58Z Structural Design and Optimization of 65nm Cu/low-k Flipchip Package ONG MENG GUAN, JIMMY MECHANICAL ENGINEERING TAY AH ONG, ANDREW VAIDYANATHAN KRIPESH Solder Joint Reliability, Finite Element Analysis, 65nm Cu/low-k, Large die, Flip Chip Package Master's MASTER OF ENGINEERING 2010-04-08T10:59:02Z 2010-04-08T10:59:02Z 2009-04-16 Thesis ONG MENG GUAN, JIMMY (2009-04-16). Structural Design and Optimization of 65nm Cu/low-k Flipchip Package. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/15936 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Solder Joint Reliability, Finite Element Analysis, 65nm Cu/low-k, Large die, Flip Chip Package
spellingShingle	Solder Joint Reliability, Finite Element Analysis, 65nm Cu/low-k, Large die, Flip Chip Package ONG MENG GUAN, JIMMY Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING ONG MENG GUAN, JIMMY
format	Theses and Dissertations
author	ONG MENG GUAN, JIMMY
author_sort	ONG MENG GUAN, JIMMY
title	Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
title_short	Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
title_full	Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
title_fullStr	Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
title_full_unstemmed	Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
title_sort	structural design and optimization of 65nm cu/low-k flipchip package
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/15936
_version_	1681079278335164416

Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

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