Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

• Main Author: ONG MENG GUAN, JIMMY
• Other Authors: MECHANICAL ENGINEERING
• Format: Theses and Dissertations
• Language: English
• Published: 2010
• Subjects: Solder Joint Reliability, Finite Element Analysis, 65nm Cu/low-k, Large die, Flip Chip Package
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/15936
• Institution: National University of Singapore

Master's