Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

Master's

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Bibliographic Details
Main Author: ONG MENG GUAN, JIMMY
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/15936
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Institution: National University of Singapore
Language: English

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