Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
Master's
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Main Author: | ONG MENG GUAN, JIMMY |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2010
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/15936 |
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Institution: | National University of Singapore |
Language: | English |
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