Structural design and optimization of 65nm Cu/low-k flipchip package

• Main Authors: Ong, J., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K., Tay, A.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73876
• Institution: National University of Singapore

10.1109/EPTC.2007.4469679