Structural design and optimization of 65nm Cu/low-k flipchip package
10.1109/EPTC.2007.4469679
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Main Authors: | Ong, J., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K., Tay, A. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73876 |
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Institution: | National University of Singapore |
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