Structural design and optimization of 65nm Cu/low-k flipchip package

10.1109/EPTC.2007.4469679

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Bibliographic Details
Main Authors:	Ong, J., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K., Tay, A.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73876
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73876
record_format	dspace
spelling	sg-nus-scholar.10635-738762023-10-30T09:57:55Z Structural design and optimization of 65nm Cu/low-k flipchip package Ong, J. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. Tay, A. MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469679 Proceedings of the Electronic Packaging Technology Conference, EPTC 488-492 2014-06-19T05:40:25Z 2014-06-19T05:40:25Z 2007 Conference Paper Ong, J., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K., Tay, A. (2007). Structural design and optimization of 65nm Cu/low-k flipchip package. Proceedings of the Electronic Packaging Technology Conference, EPTC : 488-492. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469679 1424413249 http://scholarbank.nus.edu.sg/handle/10635/73876 000253874600088 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/EPTC.2007.4469679
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ong, J. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. Tay, A.
format	Conference or Workshop Item
author	Ong, J. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. Tay, A.
spellingShingle	Ong, J. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. Tay, A. Structural design and optimization of 65nm Cu/low-k flipchip package
author_sort	Ong, J.
title	Structural design and optimization of 65nm Cu/low-k flipchip package
title_short	Structural design and optimization of 65nm Cu/low-k flipchip package
title_full	Structural design and optimization of 65nm Cu/low-k flipchip package
title_fullStr	Structural design and optimization of 65nm Cu/low-k flipchip package
title_full_unstemmed	Structural design and optimization of 65nm Cu/low-k flipchip package
title_sort	structural design and optimization of 65nm cu/low-k flipchip package
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73876
_version_	1781783343903277056

Structural design and optimization of 65nm Cu/low-k flipchip package

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