Design and characterization of interposers for high speed fine pitch wafer level packaged device testing

Master's

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Bibliographic Details
Main Author:	TAN PANG HOAW, JIMMY
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2011
Subjects:	Interposer, Fine-Pitch, High-Speed, Vertical-Compliance, Wafer-Level-Test, Characterization
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/18902
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-18902
record_format	dspace
spelling	sg-nus-scholar.10635-189022017-10-21T07:53:24Z Design and characterization of interposers for high speed fine pitch wafer level packaged device testing TAN PANG HOAW, JIMMY ELECTRICAL & COMPUTER ENGINEERING LEONG MOOK SENG OOI BAN LEONG Interposer, Fine-Pitch, High-Speed, Vertical-Compliance, Wafer-Level-Test, Characterization Master's MASTER OF ENGINEERING 2011-01-05T18:00:56Z 2011-01-05T18:00:56Z 2006-01-20 Thesis TAN PANG HOAW, JIMMY (2006-01-20). Design and characterization of interposers for high speed fine pitch wafer level packaged device testing. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/18902 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Interposer, Fine-Pitch, High-Speed, Vertical-Compliance, Wafer-Level-Test, Characterization
spellingShingle	Interposer, Fine-Pitch, High-Speed, Vertical-Compliance, Wafer-Level-Test, Characterization TAN PANG HOAW, JIMMY Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
description	Master's
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING TAN PANG HOAW, JIMMY
format	Theses and Dissertations
author	TAN PANG HOAW, JIMMY
author_sort	TAN PANG HOAW, JIMMY
title	Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
title_short	Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
title_full	Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
title_fullStr	Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
title_full_unstemmed	Design and characterization of interposers for high speed fine pitch wafer level packaged device testing
title_sort	design and characterization of interposers for high speed fine pitch wafer level packaged device testing
publishDate	2011
url	http://scholarbank.nus.edu.sg/handle/10635/18902
_version_	1681079580744482816

Design and characterization of interposers for high speed fine pitch wafer level packaged device testing

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