Electroless copper deposition and interface characteristics of ionic electroactive polymer

Electroless copper deposition and interface characteristics of ionic electroactive polymer

10.1016/j.jmrt.2021.01.062

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書目詳細資料
Main Authors:	Yang, Liang, Zhang, Dongsheng, Zhang, Xining, Tian, Aifen
其他作者:	CIVIL ENGINEERING
格式:	Article
出版:	Elsevier Editora Ltda 2022
主題:	Chemical deposition Interface IPMC Weierstrass-Mandelbrot function
在線閱讀:	https://scholarbank.nus.edu.sg/handle/10635/232504
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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