IC packaging lead frame for reducing chip stress and deformation
US5773878
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2012
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/32554 |
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sg-nus-scholar.10635-325542015-07-29T07:03:39Z IC packaging lead frame for reducing chip stress and deformation LIM, THIAM BENG BHANDARKAR, SARVOTHAM M. INSTITUTE OF MICROELECTRONICS INSTITUTE OF MICROELECTRONICS NATIONAL UNIVERSITY OF SINGAPORE US5773878 Granted Patent 2012-05-02T02:26:57Z 2012-05-02T02:26:57Z 1998-06-30 Patent LIM, THIAM BENG,BHANDARKAR, SARVOTHAM M. (1998-06-30). IC packaging lead frame for reducing chip stress and deformation. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32554 NOT_IN_WOS PatSnap |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
US5773878 |
| author2 |
INSTITUTE OF MICROELECTRONICS |
| author_facet |
INSTITUTE OF MICROELECTRONICS LIM, THIAM BENG BHANDARKAR, SARVOTHAM M. |
| format |
Patent |
| author |
LIM, THIAM BENG BHANDARKAR, SARVOTHAM M. |
| spellingShingle |
LIM, THIAM BENG BHANDARKAR, SARVOTHAM M. IC packaging lead frame for reducing chip stress and deformation |
| author_sort |
LIM, THIAM BENG |
| title |
IC packaging lead frame for reducing chip stress and deformation |
| title_short |
IC packaging lead frame for reducing chip stress and deformation |
| title_full |
IC packaging lead frame for reducing chip stress and deformation |
| title_fullStr |
IC packaging lead frame for reducing chip stress and deformation |
| title_full_unstemmed |
IC packaging lead frame for reducing chip stress and deformation |
| title_sort |
ic packaging lead frame for reducing chip stress and deformation |
| publishDate |
2012 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/32554 |
| _version_ |
1681081244755951616 |