IC packaging lead frame for reducing chip stress and deformation

• Main Authors: LIM, THIAM BENG, BHANDARKAR, SARVOTHAM M.
• Other Authors: INSTITUTE OF MICROELECTRONICS
• Format: Patent
• Published: 2012
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/32554
• Institution: National University of Singapore

US5773878