Passivation of copper interconnect surfaces with a passivating metal layer
US6468906
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2012
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sg-nus-scholar.10635-326172015-07-29T07:03:45Z Passivation of copper interconnect surfaces with a passivating metal layer CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON INSTITUTE OF MICROELECTRONICS CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) NAMYANG TECHNOLOGICAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) INSTITUTE OF MICROELECTRONICS US6468906 Granted Patent 2012-05-02T02:27:51Z 2012-05-02T02:27:51Z 2002-10-22 Patent CHAN, LAP,YAP, KUAN PEI,TEE, KHENG CHOK,IP, FLORA S.,LOH, WYE BOON (2002-10-22). Passivation of copper interconnect surfaces with a passivating metal layer. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32617 NOT_IN_WOS PatSnap |
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US6468906 |
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INSTITUTE OF MICROELECTRONICS |
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INSTITUTE OF MICROELECTRONICS CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON |
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Patent |
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CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON |
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CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON Passivation of copper interconnect surfaces with a passivating metal layer |
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CHAN, LAP |
title |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_short |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_full |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_fullStr |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_full_unstemmed |
Passivation of copper interconnect surfaces with a passivating metal layer |
title_sort |
passivation of copper interconnect surfaces with a passivating metal layer |
publishDate |
2012 |
url |
http://scholarbank.nus.edu.sg/handle/10635/32617 |
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1681081256104689664 |