Passivation of copper interconnect surfaces with a passivating metal layer

US6468906

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Main Authors: CHAN, LAP, YAP, KUAN PEI, TEE, KHENG CHOK, IP, FLORA S., LOH, WYE BOON
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32617
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Institution: National University of Singapore
id sg-nus-scholar.10635-32617
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spelling sg-nus-scholar.10635-326172015-07-29T07:03:45Z Passivation of copper interconnect surfaces with a passivating metal layer CHAN, LAP YAP, KUAN PEI TEE, KHENG CHOK IP, FLORA S. LOH, WYE BOON INSTITUTE OF MICROELECTRONICS CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) NAMYANG TECHNOLOGICAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) INSTITUTE OF MICROELECTRONICS US6468906 Granted Patent 2012-05-02T02:27:51Z 2012-05-02T02:27:51Z 2002-10-22 Patent CHAN, LAP,YAP, KUAN PEI,TEE, KHENG CHOK,IP, FLORA S.,LOH, WYE BOON (2002-10-22). Passivation of copper interconnect surfaces with a passivating metal layer. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32617 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description US6468906
author2 INSTITUTE OF MICROELECTRONICS
author_facet INSTITUTE OF MICROELECTRONICS
CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
format Patent
author CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
spellingShingle CHAN, LAP
YAP, KUAN PEI
TEE, KHENG CHOK
IP, FLORA S.
LOH, WYE BOON
Passivation of copper interconnect surfaces with a passivating metal layer
author_sort CHAN, LAP
title Passivation of copper interconnect surfaces with a passivating metal layer
title_short Passivation of copper interconnect surfaces with a passivating metal layer
title_full Passivation of copper interconnect surfaces with a passivating metal layer
title_fullStr Passivation of copper interconnect surfaces with a passivating metal layer
title_full_unstemmed Passivation of copper interconnect surfaces with a passivating metal layer
title_sort passivation of copper interconnect surfaces with a passivating metal layer
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/32617
_version_ 1681081256104689664