Incorporation of dielectric layer onto SThM tips for direct thermal analysis

US6566650

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Bibliographic Details
Main Authors:	HU, CHANG CHAUN, PEY, KIN LEONG, CHONG, YUNG FU, KIN, CHIM WAI, NEUZIL, PAVEL, CHAN, LAP
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Patent
Published:	2012
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/32639
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Institution:	National University of Singapore

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Summary:	US6566650

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