Incorporation of dielectric layer onto SThM tips for direct thermal analysis

Incorporation of dielectric layer onto SThM tips for direct thermal analysis

US6566650

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Bibliographic Details
Main Authors: HU, CHANG CHAUN, PEY, KIN LEONG, CHONG, YUNG FU, KIN, CHIM WAI, NEUZIL, PAVEL, CHAN, LAP
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32639
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Institution: National University of Singapore
id sg-nus-scholar.10635-32639
record_format dspace
spelling sg-nus-scholar.10635-326392015-07-29T07:03:47Z Incorporation of dielectric layer onto SThM tips for direct thermal analysis HU, CHANG CHAUN PEY, KIN LEONG CHONG, YUNG FU KIN, CHIM WAI NEUZIL, PAVEL CHAN, LAP ELECTRICAL & COMPUTER ENGINEERING CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE (SINGAPORE, SG) INSTITUTE OF MICROELECTRONICS US6566650 Granted Patent 2012-05-02T02:28:10Z 2012-05-02T02:28:10Z 2003-05-20 Patent HU, CHANG CHAUN,PEY, KIN LEONG,CHONG, YUNG FU,KIN, CHIM WAI,NEUZIL, PAVEL,CHAN, LAP (2003-05-20). Incorporation of dielectric layer onto SThM tips for direct thermal analysis. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32639 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description US6566650
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
HU, CHANG CHAUN
PEY, KIN LEONG
CHONG, YUNG FU
KIN, CHIM WAI
NEUZIL, PAVEL
CHAN, LAP
format Patent
author HU, CHANG CHAUN
PEY, KIN LEONG
CHONG, YUNG FU
KIN, CHIM WAI
NEUZIL, PAVEL
CHAN, LAP
spellingShingle HU, CHANG CHAUN
PEY, KIN LEONG
CHONG, YUNG FU
KIN, CHIM WAI
NEUZIL, PAVEL
CHAN, LAP
Incorporation of dielectric layer onto SThM tips for direct thermal analysis
author_sort HU, CHANG CHAUN
title Incorporation of dielectric layer onto SThM tips for direct thermal analysis
title_short Incorporation of dielectric layer onto SThM tips for direct thermal analysis
title_full Incorporation of dielectric layer onto SThM tips for direct thermal analysis
title_fullStr Incorporation of dielectric layer onto SThM tips for direct thermal analysis
title_full_unstemmed Incorporation of dielectric layer onto SThM tips for direct thermal analysis
title_sort incorporation of dielectric layer onto sthm tips for direct thermal analysis
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/32639
_version_ 1681081260019023872

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