Incorporation of dielectric layer onto SThM tips for direct thermal analysis

Incorporation of dielectric layer onto SThM tips for direct thermal analysis

US6566650

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Bibliographic Details
Main Authors: HU, CHANG CHAUN, PEY, KIN LEONG, CHONG, YUNG FU, KIN, CHIM WAI, NEUZIL, PAVEL, CHAN, LAP
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32639
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/32639

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