Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder

Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder

10.1115/IMECE2008-66308

Saved in:
Bibliographic Details
Main Authors: Babaghorbani, P., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51589
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1115/IMECE2008-66308

Similar Items