Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder
10.1115/IMECE2008-66308
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2014
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sg-nus-scholar.10635-515892024-11-14T08:07:59Z Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder Babaghorbani, P. Gupta, M. MECHANICAL ENGINEERING 10.1115/IMECE2008-66308 ASME International Mechanical Engineering Congress and Exposition, Proceedings 15 85-88 2014-04-24T10:16:01Z 2014-04-24T10:16:01Z 2009 Conference Paper Babaghorbani, P.,Gupta, M. (2009). Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder. ASME International Mechanical Engineering Congress and Exposition, Proceedings 15 : 85-88. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IMECE2008-66308" target="_blank">https://doi.org/10.1115/IMECE2008-66308</a> 9780791848760 http://scholarbank.nus.edu.sg/handle/10635/51589 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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| description |
10.1115/IMECE2008-66308 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Babaghorbani, P. Gupta, M. |
| format |
Conference or Workshop Item |
| author |
Babaghorbani, P. Gupta, M. |
| spellingShingle |
Babaghorbani, P. Gupta, M. Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| author_sort |
Babaghorbani, P. |
| title |
Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| title_short |
Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| title_full |
Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| title_fullStr |
Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| title_full_unstemmed |
Effect of processing methodology on microstructure and mechanical properties of Sn-3.5Ag solder |
| title_sort |
effect of processing methodology on microstructure and mechanical properties of sn-3.5ag solder |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51589 |
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1821230448205889536 |