Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration

10.1115/IPACK2007-33991

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Bibliographic Details
Main Authors:	Tay, A.A.O., Ho, S.L.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/51637
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-51637
record_format	dspace
spelling	sg-nus-scholar.10635-516372024-11-13T13:23:01Z Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration Tay, A.A.O. Ho, S.L. MECHANICAL ENGINEERING 10.1115/IPACK2007-33991 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 1 117-122 2014-04-24T10:17:27Z 2014-04-24T10:17:27Z 2007 Conference Paper Tay, A.A.O.,Ho, S.L. (2007). Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration. 2007 Proceedings of the ASME InterPack Conference, IPACK 2007 1 : 117-122. ScholarBank@NUS Repository. <a href="https://doi.org/10.1115/IPACK2007-33991" target="_blank">https://doi.org/10.1115/IPACK2007-33991</a> 0791842770 http://scholarbank.nus.edu.sg/handle/10635/51637 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1115/IPACK2007-33991
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O. Ho, S.L.
format	Conference or Workshop Item
author	Tay, A.A.O. Ho, S.L.
spellingShingle	Tay, A.A.O. Ho, S.L. Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
author_sort	Tay, A.A.O.
title	Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
title_short	Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
title_full	Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
title_fullStr	Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
title_full_unstemmed	Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
title_sort	optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/51637
_version_	1821207564824608768

Optimization of copper column flip chip packages incorporating a variable interconnect compliance configuration

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