Effect of delamination on the thermal fatigue of solder joints in flip chips
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
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sg-nus-scholar.10635-517022024-11-13T13:23:06Z Effect of delamination on the thermal fatigue of solder joints in flip chips Ong, E.T. Tay, A.A.O. Wu, J.H. INSTITUTE OF MICROELECTRONICS MECHANICAL & PRODUCTION ENGINEERING Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 200-207 PITEF 2014-04-25T07:54:55Z 2014-04-25T07:54:55Z 2000 Article Ong, E.T.,Tay, A.A.O.,Wu, J.H. (2000). Effect of delamination on the thermal fatigue of solder joints in flip chips. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 : 200-207. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/51702 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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| description |
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
| author2 |
INSTITUTE OF MICROELECTRONICS |
| author_facet |
INSTITUTE OF MICROELECTRONICS Ong, E.T. Tay, A.A.O. Wu, J.H. |
| format |
Article |
| author |
Ong, E.T. Tay, A.A.O. Wu, J.H. |
| spellingShingle |
Ong, E.T. Tay, A.A.O. Wu, J.H. Effect of delamination on the thermal fatigue of solder joints in flip chips |
| author_sort |
Ong, E.T. |
| title |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
| title_short |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
| title_full |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
| title_fullStr |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
| title_full_unstemmed |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
| title_sort |
effect of delamination on the thermal fatigue of solder joints in flip chips |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/51702 |
| _version_ |
1821226074762117120 |