Effect of delamination on the thermal fatigue of solder joints in flip chips
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
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sg-nus-scholar.10635-517022015-01-16T02:50:31Z Effect of delamination on the thermal fatigue of solder joints in flip chips Ong, E.T. Tay, A.A.O. Wu, J.H. MECHANICAL & PRODUCTION ENGINEERING INSTITUTE OF MICROELECTRONICS Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 200-207 PITEF 2014-04-25T07:54:55Z 2014-04-25T07:54:55Z 2000 Article Ong, E.T.,Tay, A.A.O.,Wu, J.H. (2000). Effect of delamination on the thermal fatigue of solder joints in flip chips. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 : 200-207. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/51702 NOT_IN_WOS Scopus |
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Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
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MECHANICAL & PRODUCTION ENGINEERING |
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MECHANICAL & PRODUCTION ENGINEERING Ong, E.T. Tay, A.A.O. Wu, J.H. |
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Ong, E.T. Tay, A.A.O. Wu, J.H. |
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Ong, E.T. Tay, A.A.O. Wu, J.H. Effect of delamination on the thermal fatigue of solder joints in flip chips |
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Ong, E.T. |
title |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
title_short |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
title_full |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
title_fullStr |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
title_full_unstemmed |
Effect of delamination on the thermal fatigue of solder joints in flip chips |
title_sort |
effect of delamination on the thermal fatigue of solder joints in flip chips |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/51702 |
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