Effect of delamination on the thermal fatigue of solder joints in flip chips

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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Main Authors: Ong, E.T., Tay, A.A.O., Wu, J.H.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51702
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-517022015-01-16T02:50:31Z Effect of delamination on the thermal fatigue of solder joints in flip chips Ong, E.T. Tay, A.A.O. Wu, J.H. MECHANICAL & PRODUCTION ENGINEERING INSTITUTE OF MICROELECTRONICS Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 200-207 PITEF 2014-04-25T07:54:55Z 2014-04-25T07:54:55Z 2000 Article Ong, E.T.,Tay, A.A.O.,Wu, J.H. (2000). Effect of delamination on the thermal fatigue of solder joints in flip chips. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 2 : 200-207. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/51702 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
Ong, E.T.
Tay, A.A.O.
Wu, J.H.
format Article
author Ong, E.T.
Tay, A.A.O.
Wu, J.H.
spellingShingle Ong, E.T.
Tay, A.A.O.
Wu, J.H.
Effect of delamination on the thermal fatigue of solder joints in flip chips
author_sort Ong, E.T.
title Effect of delamination on the thermal fatigue of solder joints in flip chips
title_short Effect of delamination on the thermal fatigue of solder joints in flip chips
title_full Effect of delamination on the thermal fatigue of solder joints in flip chips
title_fullStr Effect of delamination on the thermal fatigue of solder joints in flip chips
title_full_unstemmed Effect of delamination on the thermal fatigue of solder joints in flip chips
title_sort effect of delamination on the thermal fatigue of solder joints in flip chips
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/51702
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